半导体全自动植球机是做什么的
半导体全自动植球机是做什么的?用来批量BGA植球的机器,高精度半自动植球机。在表面组装工艺生产(SMT)中,用于大批量高精度的芯片植球专用生产设备。采用全新设计,更加精确、更加强大、更加开放,同时具有较低的维护成本。
半导体全自动植球机
BGA植球机参数:
(1)外部尺寸 :75cm(L),X 25cm(W),X 26cm(H)
<Outside dimension: 75cm(L), 25cm(W), 26cm(H).
(2)重 量 : 30.5 kg.
<Weight: 30.5 kg.
(3)使用电压 : 220V 50/60Hz.
<Working voltage: 220V 50/60Hz
(4).最大使用電流 : 1.2 A
<Maximum working current : 1.2A
(5)使用气压 : 6 kg/cm.
<Working air pressure: 6 kg/cm.
(6)锡球规格 :依BGA不同使用锡球规格而异.
<Solder ball specification: According to the solder ball spec being used by different kinds of BGA package.
(7)BGA 模具 :依BGA不同规格SIZE可更换需求BGA模具.
<BGA IC holder: It is available for changing-over different types of BGA IC holders according to different size or spec of BGA package.
(8) BGA 模具 :依BGA不同规格SIZE可更换需求锡球模具模具.
<Solder ball screening fixture: It is available for changing-over different ball screening fixtures according to different size or spec of solder ball.
(9)锡球植入速度: 锡球植入BGA-PAD点可微调控制锡球植入速度.
<Solder ball placing speed: The speed for placing solder balls onto BGA pads can be adjusted and fine-tuning controlled.
(10)锡球植入率:百分之98
<Ball-placing yield rate: 98%.
(11)锡球植入精度:0.03 mm.
<Ball-placing accuracy: 0.03mm.
(12)模具槽退料:退料速度30 - 300 mm/S.
<BGA IC holder unloading speed: Unloading speed 30~300 mm/s.
(13)自动植球时间:22/sec